Qualcomm Internship 2024 for Interim Engineering Intern SW/HW, Qualcomm Drive is organizing Off Campus Drive for candidates in Any Batch. In order to apply, candidates should have degree in Masters/Bachelors: Computer Science Engineering, Communication Engineering, ECE, If you are interested, Please apply as soon as possible.
Company Name: Qualcomm
Role: Interim Engineering Intern SW/HW
Location: Hyderabad/Chennai/Bangalore/Noida
Experience: Freshers
Qualification: Masters/Bachelors: Computer Science Engineering, Communication Engineering, ECE,
Batch: Any Batch
Job Type: Full Time
Salary: ₹45,000–₹52,449 per month (Via AmbitionBox)
Qualcomm Internship 2024
Details About Interim Engineering Intern SW :
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.
General Summary :
Job Area: Engineering – Software
Job Location: Hyderabad / Bangalore / Chennai / Noida
As a software engineer, you will design, develop Software for Qualcomm’s mobile chipsets which are based on cutting edge technology.
Qualcomm is looking for energetic, creative and self-driven engineer to work in
Multimedia Technologies such as Audio and Video codecs, Image Processing, ➢ Wireless Modem Technologies, such as 4G, WiFi, Bluetooth, Self-Organizing Networks.
Platform Level SW, such as, Linux, Android, Windows, Board Support Packages. ➢ IOT Technologies, for Connected Cameras, Smart Assistants, Drones, Virtual Reality, Augmented Reality.
Campus Grads will be working on following areas :
- Development of real-time embedded software and device drivers
- Mobile SW development for Windows Mobile, Android or Linux • Good understanding of OS concepts, Data structures, etc
- C/C++ and object oriented design
- Wireless network standards such as CDMA/GSM/UMTS/LTE
- Linux/UNIX, Linux Drivers, Linux Kernel Development
- Protocols such TCP/UDP/IP/SIP/RTP etc
- Multimedia technologies including Audio, Video, Imaging
- Excellent analytical and problem solving skills
- Ability to collaborate and work in teams.
- Good verbal and written communication
Skill Opportunities include :
- SW development for Android, Window Mobile based Embedded Platforms
- Multimedia software stack, firmware and driver Development
- Wireless Modem and connectivity Software and Firmware Development
- Communication protocol stack Software Development
- Kernel, BSP and Device Driver Development
- Application SW and UI development.
- SW Architecture for embedded devices based on Android, Windows.
- Design and development based on Object oriented programming.
- Education: Masters, Bachelors: Computer Science Engineering, Communication Engineering, ECE,
Details About Interim Engineering Intern HW :
- Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives.
- But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.
General Summary :
We know our employees’ ideas change the world. For more than three decades, we’ve been a global leader in mobile technology, continually pushing the boundaries of what’s possible. Working with customers across industries — from automotive to health care, from smart cities to robotics— we continue to accelerate innovation and unlock new possibilities in a time where everything is connected. By joining the Qualcomm family, you too can bring the future forward faster.
- SOC & Hard Macro Physical Design
- SOC Validation & Debug
- RF & Analog Layout
- RF/Analog/Mixed Signal/Power IC Design
- Low Power Design
- Board and FPGA Design
- Digital ASIC Design
- Design/SOC Verification
- CAD Solution Engineer
- Design for Test (DFT)
- CPU Design
Must have educational background in one or more of the following areas :
- Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
- Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
- Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
- Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
- Excellent analytical and problem solving skills.
- Ability to collaborate and work in teams.
- Good verbal and written communication skill
How To Apply For Qualcomm Internship 2024?
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Fill the details with the information provided.
Before submitting the application, cross-check the information you’ve provided.
Apply Link For Interim Engineering Intern SW: Click here
Apply Link For Interim Engineering Intern HW: Click here
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